Thermal Imaging System for Failure Analysis and Troubleshooting
TRUSEE Failure Analysis and Troubleshooting Thermal Imaging System provides a powerful non-contact method of PCB failure analysis taking advantage of infrared temperature measurement and unique Lock-in algorithm. Inhomogeneous temperature distribution, local power loss, leakage currents and soldering issues can be measured with this system, which provides two orders of sensitivity increase compared with traditional thermography methods.
Product description
TRUSEE Failure Analysis and Troubleshooting Thermal Imaging System provides a powerful non-contact method of PCB failure analysis taking advantage of infrared temperature measurement and unique Lock-in algorithm. Inhomogeneous temperature distribution, local power loss, leakage currents and soldering issues can be measured with this system, which provides two orders of sensitivity increase compared with traditional thermography methods.
◆ Software Interface
– Clear and user-friendly UI;
– Real-time thermography display with integrated color modes;
– 0-90° phase diagram display, check heat dispersion procedure frame by frame;
– Highlighted abnormal heat spot, 3D heat map display;
– Higher location accuracy with thermography-RGB image fusion technology;
– Customizable functions;
◆ 6 Advantages
Ultra high sensitivity
0.001K temperature difference、microampere leakage detectable
NETD<=50mK
Advanced Lock-in technology and 3D
filtering algorithm
High Accuracy of Positioning
1024*768 FPA detector
thoroughly customized motorized lens
Positioning accuracy up to 20μm, can
locate 01005 package components
Thermography-RGB image fusion
technology available
Wide Range of Application
Max Input voltage：15V
Max working current：3A
Max detection area：
300mm×250mm (M type)
700mm×550mm (L type)
Rich Detection Functions
Fast location of heat sources with
amplitude display
Phase diagram helps to distinguish heat
dispersion timing
Accurate location with thermography-RGB
image fusion technology
Device current waveform detectable
Traditional thermography mode available
Reliable and stable
Detector with high stability
Passed through rigorous reliability
tests
EMI tests passed
With overcurrent protection
User friendly
Small size desk-top equipment
Only 1 USB cable needed for
communication
Clear and simple interface
Results can be updated and saved for
subsequent analysis
– Case 1：Mobile phone circuit board repair
Electronic components on mobile phone circuit boards are small and densely arranged. Circuit repair requires high image resolution and ultrahigh sensitivity to detect low to micro-ampere leakage currents, which could hardly achieve by traditional methods.
Our customer realized the failure location and analysis of most of this kind of mobile phone circuit boards by TRUSEE M-type equipment, and obtained high economic benefits.
– Case 2：Verification and Failure Analysis of Telecommunications Equipment Circuit Boards
Telecommunication equipment circuit boards are usually of large size, expensive and complex,making product verification and failure location very difficult. This type of circuit boards needs to be compared and verified between normal ones.
Our customer uses TRUSEE L-type device with dual power supply and large field of view and realized highly efficient and low-cost inspection and maintenance.
– Case 3：R&D Center Applications
Some circuits need to be debugged repeatedly during R&D process. It is often difficult to figure out reasons of abnormal functions caused by current leakage. For some complex circuit boards, location of failure often cost several weeks or even longer time, which brings great impact of project process and increased risk. Our customer introduced our equipment and most of the abnormalities can be located within a few minutes, which greatly improves the efficiency and guarantees the project progress.
